Copper deposition baths: Advanced analytical solutions for development and monitoring
The chemistry of copper plating baths is complex, and each component plays a role in the quality of the final product. The composition evolves as such baths are used and adjustment decisions must be made on reliable, relevant data.
In our upcoming webinar, we present a multi‑method analytical approach as the most efficient way to develop and monitor copper deposition baths. By combining titration and cyclic voltammetric stripping (CVS) with complementary techniques such as pH measurement and X‑ray fluorescence (XRF), users gain a complete picture of their plating bath chemistry.
Each method targets a specific class of components: While titration offers a robust and efficient way to quantify the main metallic components, salts, and anions, CVS is the industry standard method for measuring the organic additives in the baths. XRF offers additional insight regarding the presence of metallic contaminants and additives.
After a close look at the specific strengths of these methods, how they complement each other, and automation options, our presenters will answer any questions you may have on the webinar topic in a Q&A session.
Key learning points of this webinar:
- Learn the power of method combination: How tiration and CVS can be integrated with other analytical techniques like XRF and pH measurement to provide a more complete understanding of the plating bath chemistry.
- The benefits of automation beyond increased throughput and general convenience: How to eliminate operator relative variance, increase repeatability, and ensure that optimzed analytical approaches can be applied consistently in multiple locations.
- Why our analytical technologies are perfectly suited for the various players in this industry, from bath chemistry development to the production floor.
Who should attend this webinar?
- Production managers that oversee the day-to-day production process
- QC professionals in charge of ensuring product quality
- Researchers involved in the development of new copper plating technologies and advanced bath chemistry
Presenter: Dr. Julia van Drunen (Head of Competence Center, Voltammetry, Metrohm)
Julia van Drunen completed her Ph.D. in electrochemistry at Queen’s University in 2013 and worked for two years as a post-doctoral researcher at the University of Sao Paulo before joining Metrohm Autolab in the Netherlands in 2016 and Metrohm HQ in 2024. She specializes in the topics of surface electrochemistry of nickel and platinum, electrocatalysis, and the corrosion of metals and alloys.
Presenter: Dr. Christian Haider (Head of Competence Center Titration, Metrohm International Headquarters)
Dr. Christian Haider joined Metrohm International Headquarters in 2002 where he started as an Application Specialist Titration. He has advanced his career at Metrohm to become Head of Competence Center Titration and in this position leads a team of Product Managers, Product Specialists, and Application Chemists for all the different titration techniques, pH and conductivity measurement, titration automation, and software.
Presenter: Jeroen Zaalberg (Head of Product Management, Metrohm Applikon)
Jeroen Zaalberg joined Metrohm Process Analytics in 2008 and has worked as an application chemist, Product Manager Wet-Chemistry, and is currently in the position of Head of Product Management.
Jeroen has a BSc in analytical and physical chemistry and has a passion for product development, innovation and strategy. Over the recent years, Jeroen successfully launched several new products in the Metrohm Process Analytics portfolio.
